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[Case Study] Automated System for Lead Inspection After Writing

Contributing to stable writing quality! A case where implementation defects such as lead bending were reduced.

We would like to introduce a case of custom solutions we have implemented. In an automation system, we built a system that performs image processing with a high-precision CCD camera to correct the position of devices that are picked up from a tray and implemented into IC sockets. By correcting the positional deviation of the devices caused by the clearance in the tray, we can implement them into the IC sockets without stressing the leads, thereby reducing implementation defects such as lead bending. Additionally, the image recognition processing can also accommodate simple lead bending inspections, contributing to stable writing quality. 【Case Overview】 ■ Industry: Automotive devices, precision equipment, home appliances/OA equipment, mobile/communication devices, semiconductor equipment, FA equipment/industrial machinery, and others ■ Application: ALL ■ Devices: Serial FLASH, microcontrollers ■ Purpose/Features: Custom solutions, quality control ■ Supported Programmers: TEH27/28 series *For more details, please refer to the PDF document or feel free to contact us.

• Company：東亜エレクトロニクス フラッシュサポートグループカンパニー
• Price：Other

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